Xpedition IC Packaging Solutions

Xpedition IC Packaging Solutions

Bringing package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for HDAP rapid prototyping assembly, physical design, verification, signoff, and modeling.

Xpedition IC Packaging Design

Xpedition IC Packaging Design tools provide a complete design solution for creating complex, multi-die homogeneous or heterogeneous devices using FOWLP, 2.5/3D, or system-in-package (SiP) modules, as well as IC package assembly prototyping, planning, co-design, and substrate layout implementation.

Xpedition Substrate Integrator

Graphical virtual prototyping and planning environment tuned for the exploration and integration of heterogenous ASIC/chiplets and interposers using System Technology Co-Optimization (STCO) with predictive multi-physical analysis.

Xpedition Package Designer

Complete physical design and verification solution. Support heterogeneous using the latest silicon and wafer-based technologies such as RDL fan-out wafer-level packaging (FOWLP) and 2.5/3DIC.

IC Package Simulation

Analysis of die/package signal and power integrity, EM coupling, and thermal conditions. Fast, easy to use, and accurate, these tools ensure that engineering intent is fully achieved.

Signal Integrity Analysis

Ensure that you are getting right the first time, avoiding costly overdesign, and saving recurrent test cycles with built-in HyperLynx signal integrity analysis.

HyperLynx Power Integrity

Accurately model power distribution networks and noise propagation mechanisms to identify potential power integrity distribution issues that interfere with package design logic and validate solutions.

Calibre xACT

Integrated capacitance field solver delivers reference-level accuracy with deterministic results.

Simcenter Flotherm XT

A powerful suite of 3D computational fluid dynamics (CFD) software to predict airflow and heat transfer in and around complex 3D IC Package assemblies and associated PCB systems.

System-Level Package Signoff

Physical verification and signoff that meet foundry and OSAT requirements ensure performance and time-to-market goals are met.

Calibre nmDRC

The Clibre nmDRC platform enables reduced cycle time with revolutionary new capabilities that substantially differentiate Calibre nmDRC design rule checking from traditional DRC tools.

Calibre 3DSTACK

Calibre 3DSTACK technology provides comprehensive support for an extensive range of multi-die integration methodologies and processes, including system-level DRC, LVS and PEX.