Multi-Discipline Systems Engineering

Multi-Discipline Systems Engineering

Xpedition delivers integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA and MCAD to ensure teams have the flexibility and intuitive technologies they need.

Enable a digital thread from requirements through manufacturing

IC Packaging/PCB Co-design
- Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met

A/D/RF Co-design
- The design and shielding of complex RF circuits. Engineers can enter schematics, optimize layout, and prepare for manufacturing when designing with RF circuits.

PCB/Harness Co-design
- Scale to support everything from the simplest cable within an electronic box or LRU to complex harnesses connecting LRUs in systems-of-systems designs.

Multi-board design
- Integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA and MCAD to ensure teams have the flexibility and intuitive technologies they need.
ECAD/MCAD Co-design
- Efficient collaboration between the ECAD and MCAD domains so they can optimize their electronics designs within tight form-factor constraints while still meeting quality, reliability, and performance requirements.
FPGA/PCB Co-design
- I/O optimization technology provides an extensive set of functionality to ease the FPGA-on-board integration process.

Design teams can minimize rework and improve product quality through multiple disciplines:

Multi-Board Design

Improve team efficiency with an automated workflow multi-board system definition, partitioning and integration of individual board designs.

ECAD/MCAD Co-Design

Collaborate efficiently between ECAD and MCAD domains to optimize electronics within tight form factor constrains while still meeting quality, reliability and performance requirements.

FPGA/PCB Co-Design

Eliminate the barriers between FPGA and PCB design organizations, enabling concurrent design processes with greater accuracy and speed. Optimize the FPGA I/O in the context of the PCB layout.

IC Packaging/PCB Co-Design

Address high density advanced package (HDAP) rapid prototyping assembly, physical design, verification, signoff and modeling co-designed in context with the ICs and PCBs in the electronics system.

A/D/RF Co-Design

Concurrently design RF circuits in the context of the entire PCB, ensuring optimal density and minimal interference. Dynamically integrate with industry RF simulation tools to reduce design cycles.

PCB/Harness Co-Design

Ensure accurate connectivity in systems interconnected via cables by co-designing them with the multi-board hardware. Optimize cabling to ensure optimal performance of the complete system.